Dr. Yuan's paper wins Awards for Excellence 2016

Dr. Yuan has been worked on advanced packaging from IC packaging technology to LED technology. He started the research on 3D LED System in Packaging (SiP) as prioneer back his working in TNO (NL). Dr. Yuan's paper, "3D system-in-package design using stacked silicon submount technology", published at Microelectronics International, is selected as the Outstanding Paper in the 2016 Emerald Literati Network Awards for Excellence.

"3D packaging for LED is wonderful idea," Dr. Yuan said, after knowing his paper received the outstanding awards, "but it requires a close team work with multidisciplinary members."

"There are many tasks before the industrialization," he continuous, "one of the major challenges is the reliability issues due to the integration of multiple domains. Technically, these induce a management challenge: different people speaks different language. It requires time and patient to build a close-working team. "

"The time for 3D SiP integration will come in LED," Dr. Yuan addressed, "The business demand will drive it to happen, like the electronics."